Postdoctoral Fellow In Biomedical Engineering

The Department of Biomedical Engineering at The Hong Kong Polytechnic University invites applications for a Postdoctoral Fellow position within the research centre for non-invasive brain-computer interface. This role supports the project leader in cutting‑edge research aimed at developing novel interfaces between the brain and external devices without surgical implantation.

The successful candidate will contribute to experimental design, data acquisition, and analysis involving neural signals, with a particular emphasis on techniques such as optogenetics and ultrasonics. The project integrates knowledge from biomedical engineering, neuroscience, neurobiology, biophysics, and cellular/molecular biology to advance understanding of brain activity and its translation into control signals for assistive technologies.

Applicants must possess a doctoral degree (PhD) or an equivalent qualification in a relevant discipline. Additionally, candidates should have no more than five years of post‑qualification research experience at the time of application. A strong track record in the aforementioned fields is essential, and hands‑on experience with optogenetic manipulation or ultrasonic neuromodulation will be viewed favorably.

Beyond technical expertise, the position demands excellent interpersonal and communication skills, as the fellow will collaborate with multidisciplinary teams and may be required to present findings at conferences or in publications. Preference will be given to applicants with a good publication record in peer‑reviewed journals.

The appointment is offered on a full‑time basis with a highly competitive remuneration package. The initial contract period ranges from twelve to twenty‑four months, subject to performance and funding availability. The successful candidate will be based at the university’s main campus in Hong Kong, providing access to state‑of‑the‑art laboratories and research facilities.

Interested individuals are encouraged to contact Prof. Lei Sun directly for further details about the project and application procedure. The closing date for applications is 30 October 2026.